Comments for Package Matters http://javier.esilicon.com From die floorplanning to system integration, the ecosystem of the package Tue, 29 Nov 2011 23:03:09 +0000 hourly 1 http://wordpress.org/?v=3.0.1 Comment on Thru-Silicon Vias, Current State of the Technology by I Surf Anonymous http://javier.esilicon.com/2011/01/30/thru-silicon-vias-current-state-of-the-technology/comment-page-1/#comment-58 I Surf Anonymous Tue, 29 Nov 2011 23:03:09 +0000 http://javier.esilicon.com/?p=150#comment-58 Wonderful Post on -2 associated anonymous email. I actually have always been in the -2 corporation as well. john Wonderful Post on -2 associated anonymous email. I actually have always been in the -2 corporation as well.
john

]]> Comment on The Future of ASICs in 3D by John Patterson http://javier.esilicon.com/2011/05/12/the-future-of-asics-in-3d/comment-page-1/#comment-12 John Patterson Tue, 17 May 2011 13:05:53 +0000 http://javier.esilicon.com/?p=313#comment-12 Nice article. John Patterson Nice article.

John Patterson

]]> Comment on Misuse of thermal numbers by Sharmaine Lehrfeld http://javier.esilicon.com/2010/06/21/misuse-of-thermal-numbers/comment-page-1/#comment-11 Sharmaine Lehrfeld Sun, 27 Mar 2011 16:41:03 +0000 http://javier.esilicon.com/?p=104#comment-11 I found your website on google. allowed me to really understand this topic. I have spent lots of time looking through your site. You have something good going here, keep it up! I found your website on google. allowed me to really understand this topic. I have spent lots of time looking through your site. You have something good going here, keep it up!

]]> Comment on Thru-Silicon Vias, Current State of the Technology by Javier DeLaCruz http://javier.esilicon.com/2011/01/30/thru-silicon-vias-current-state-of-the-technology/comment-page-1/#comment-9 Javier DeLaCruz Fri, 18 Feb 2011 22:24:02 +0000 http://javier.esilicon.com/?p=150#comment-9 Thanks for the opportunity John. I'll contact you directly. Thanks for the opportunity John. I’ll contact you directly.

]]> Comment on Thru-Silicon Vias, Current State of the Technology by John Miklosz http://javier.esilicon.com/2011/01/30/thru-silicon-vias-current-state-of-the-technology/comment-page-1/#comment-8 John Miklosz Fri, 18 Feb 2011 20:53:32 +0000 http://javier.esilicon.com/?p=150#comment-8 Hello Javier, I recently came upon your blog and included it in our Blog Roll (http://www.soccentral.com/results.asp?EntryID=29863) as well as the SOCcentral.com News Page (http://www.soccentral.com/results.asp?CatID=183). Please take a few moments to visit the site and see what we've done. I would very much like to use "Thru-Silicon Vias, Current State of the Technology" as a feature article on SOCcentral.com. We'll do all of the work required to reformat it for the site so that this places no burden on you. Please let me know what you think. Thanks John Miklosz, Editor-in-Chief Hello Javier,

I recently came upon your blog and included it in our Blog Roll (http://www.soccentral.com/results.asp?EntryID=29863) as well as the SOCcentral.com News Page (http://www.soccentral.com/results.asp?CatID=183). Please take a few moments to visit the site and see what we’ve done.

I would very much like to use “Thru-Silicon Vias, Current State of the Technology” as a feature article on SOCcentral.com. We’ll do all of the work required to reformat it for the site so that this places no burden on you.

Please let me know what you think.

Thanks

John Miklosz, Editor-in-Chief

]]> Comment on Should you be leadfree? Maybe not! by izdelava spletnih strani http://javier.esilicon.com/2010/08/14/should-you-be-leadfree-maybe-not/comment-page-1/#comment-6 izdelava spletnih strani Sun, 06 Feb 2011 16:49:24 +0000 http://javier.esilicon.com/?p=173#comment-6 I'm not sure exactly why but this site is loading incredibly slow for me. Is anyone else having this issue or is it a problem on my end? I'll check back later on and see if the problem still exists. I’m not sure exactly why but this site is loading incredibly slow for me. Is anyone else having this issue or is it a problem on my end? I’ll check back later on and see if the problem still exists.

]]> Comment on Thru-Silicon Vias, Current State of the Technology by Thru-Silicon Vias, Current State of the Technology « Package Matters | Silcon Group http://javier.esilicon.com/2011/01/30/thru-silicon-vias-current-state-of-the-technology/comment-page-1/#comment-4 Thru-Silicon Vias, Current State of the Technology « Package Matters | Silcon Group Sun, 30 Jan 2011 14:41:17 +0000 http://javier.esilicon.com/?p=150#comment-4 [...] More:  Thru-Silicon Vias, Current State of the Technology « Package Matters [...] [...] More:  Thru-Silicon Vias, Current State of the Technology « Package Matters [...]

]]> Comment on The Demise of the CDBGA (Cavity-Down BGA) by electronic components http://javier.esilicon.com/2010/02/16/the-demise-of-the-cdbga-cavity-down-bga/comment-page-1/#comment-2 electronic components Tue, 03 Aug 2010 22:46:56 +0000 http://javier.esilicon.com/?p=3#comment-2 I remember packaging for BGA components being time consuming due to tray sizes. I remember packaging for BGA components being time consuming due to tray sizes.

]]>