Package Matters

3D technology is generating a lot of interest as a way to reduce NRE costs and speed time to market. It is in its nascency so people are looking for a single standard in through-silicon vias (TSVs). This is mainly for reducing infrastructure costs. Unfortunately, I do not think this will be the case. There are [...]

As serdes data rates have been going up for years, and 10-Gbps interfaces have been becoming commonplace, I figured a few years ago that pin counts on packages would start going down.  Boy, was I wrong on that prediction!  The trend instead was to put more of those high-speed interfaces on devices.

For years, a 45x45mm body size [...]