Javier DeLaCruz is the manufacturing technology director at eSilicon Corporation. He is responsible for all package engineering activities including design, package selection, electrical extraction and simulation, co-design activities with the physical design teams, and system-level integration.
DeLaCruz has over 15 years of experience in semiconductor packaging and is a senior member of IEEE. He has extensive knowledge in analog design, high-speed digital design, thermal and electrical simulation, and package assembly.
Prior to eSilicon, DeLaCruz served as principal packaging engineer at Multilink Technology where he managed the packaging team and personally developed most of the enabling technologies that allowed for lower-cost packaging that serviced the optical networking market at 10Gbps and 40Gbps data rates. Previously, he served as technical program manager for the eastern U.S. at STATS where he provided packaging expertise on various technologies to their customer base. DeLaCruz started his career in M/A-COM’s research and development group where he used his electrical, mechanical and thermal background to develop analog packaging technology and other related patented work.
Javier holds a Bachelor of Science in Engineering from Stevens Institute of Technology and a Master of Science in Engineering from Boston University.
