Cross Section of TSVs, source: P. Leduc, LETI, D43D, 2010
Ready for primetime in ASICs…almost
Thru-silicon-vias (TSVs) have become a very hot topic in in recent months. Ever since Xilinx reported that they are using a 2.5D TSV approach for their Virtex-7 FPGAs (http://bit.ly/ayfOgy), the industry started to salivate with the prospects of this new technology. While this [...]