Jack Harding, eSilicon CEO, for GSA Board 2012

Going MCM? Do it backwards!

As packages evolve into the 3D space or other formats of SiP (System-in-Package) integration, one thing is clear.  The integration has to be planned first.  This integration has to be considered from the system-level and die floorplan concurrently.  I often see prospective clients with SiP solutions where various components were designed in isolation of the complementary [...]