Jack Harding, eSilicon CEO, for GSA Board 2012

Flipchip – heatspreader or go naked?

Questions and debate are common with the use of heatspreaders on flipchip BGA (FCBGA) packages.   This is one of those topics where “it depends” is said far too often.  From a cost standpoint, it is clear that the use of a heatspreader should be avoided.  On the other hand, there are many valid reasons why they [...]

Package reliability explained with a ketchup packet

Have you ever wondered while having fast food why you can only open a condiment packet from the edges that have a crinkle-cut? If you do try to open those packets from the long smooth sides, you’ll either need really sharp teeth or a pair of scissors since your fingers alone will just not cut it. The [...]