Jack Harding, eSilicon CEO, for GSA Board 2012

The Demise of the CDBGA (Cavity-Down BGA)

Cavity down BGA’s were once the staple of high-performance and high power packages.  The excellent thermal path made them the option of choice for processors and other power hungry devices. 

While there were many reasons that these devices fell out of favor, two reasons stand out.  Firstly (and more obviously), in comparison to other newer technologies, CDBGA’s [...]

The changing face of OSAT subcontractors

Before the recession of 2001, OSAT (OutSourced Assembly and Test) subcontractors had a shotgun approach to customer acquisition. They would target large and small customers alike in order to capture as much market share as possible in a race to be the largest. This introduced lot of inefficiencies due to the 80-20 rule of product support. [...]