|
||||||
|
Cross Sectional Drawing of TSV TSV’s (through-silicon-vias) are vias through a silicon die that allow for connections to pass to and from the active side of the die to the backside. These have the potential to really change the 3D playing field for SiP (system in package) applications but are really limited at the moment to [...] That empty space between the inner array of balls and peripheral balls serve an important purpose in conventional BGA packages. Before we dive into that purpose, lets take a moment to describe some of the characteristics of these broadly used conventional BGA packages. One of the key attributes that make these packages so popular is their low cost, and [...] |
||||||
|
Copyright © 2012 Package Matters - All Rights Reserved |
||||||
